Proceedings of the 6th International Microelectronics Conference
Inspection/Repair technique The most important objective of LSI bare chips bonding has been to inspect and repair them after ... If repair is repeated twice, three times or more, it is possible to further improve the total yield of the LCD panel.
| Title | : | Proceedings of the 6th International Microelectronics Conference |
| Author | : | |
| Publisher | : | - 1990 |
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